The University of Hong KongThe University of Hong Kong
University Central Facilities
Interdisciplinary and Core Research Facilities

  1. Facilities
  2. Central Fabrication Laboratory (Deposition)

Kurt J. Lesker Mini SPECTROS (PVD-Sputter)
Physical Vapor Deposition - Sputtering System

Kurt J. Lesker Mini SPECTROS Sputtering System is a compact, high-performance thin film deposition platform designed for research and development. Built on the proven SPECTROS architecture, it offers reliable sputtering of metals, insulators, and multilayers with advanced process control. It delivers precision, flexibility, and reproducibility for materials science and semiconductor applications.

Attachments / Specifications:

- Three 3” Torus® Magnetron Sputtering sources
- DC sputtering power source: 1500 W
- RF sputtering power source: 300 W at 13.56 MHz
- Base pressure: 5 x 10-7 torr
- Substrate size: 2~6 inch Si/glass substrate, small specimen
- Substrate fixture: rotation and water cooling
- Target available: Ag, Ta, Cu, ITO, Ni & SiO2
- Deposition rate: SiO2 25 Å/min; Cu 170 Å/min

Person-in-charge:

Mr. Yip P. S. - psanyip@hku.hk

Project/ Fund Source:

BRC(2020/21)/ UDF(2020/21), Nanofabrication Facilities

Kurt J. Lesker Mini SPECTROS (PVD-E Beam)
Physical Vapor Deposition - E beam Systen

Kurt J. Lesker Mini SPECTROS Sputtering System is a compact, high-performance thin film deposition platform designed for research and development. Built on the proven SPECTROS architecture, it offers reliable sputtering of metals, insulators, and multilayers with advanced process control. It delivers precision, flexibility, and reproducibility for materials science and semiconductor applications.

Attachments / Specifications:

- 4 pocket 8 cc Electron Beam Evaporation Source
- E-beam power source: 5 KW
- Base pressure: 5 x 10-7 torr
- Substrate size: 2~6 inch Si/glass substrate, small specimen
- Substrate fixture: rotation and water cooling
- Film thickness controller with 2 crystal sensors
- Source available: Al, Au, Cr, Pt & Ti

Person-in-charge:

Mr. Yip P. S. - psanyip@hku.hk

Project/ Fund Source:

BRC(2020/21)/ UDF(2020/21), Nanofabrication Facilities

Kurt J. Lesker Mini SPECTROS (PVD-Thermal)
Physical Vapor Deposition - Thermal Evaporation System

Kurt J. Lesker Mini SPECTROS Sputtering System is a compact, high-performance thin film deposition platform designed for research and development. Built on the proven SPECTROS architecture, it offers reliable sputtering of metals, insulators, and multilayers with advanced process control. It delivers precision, flexibility, and reproducibility for materials science and semiconductor applications.

Attachments / Specifications:

- Three Thermal Evaporation Sources
- Thermal Evaporation power source: DC power supply, up to 12 V or 400 A, max 2 kW applied power
- Two 10cc Low Temperature Evaporation organic material sources
- Two 1cc Low Temperature Evaporation organic material sources
- Base pressure: 5 x 10-7 torr
- Substrate size: 2~6 inch Si/glass substrate, small specimen
- Substrate fixture: rotation and 350 °C heating
- Film thickness controller with 3 crystal sensors
- Source available: Ag, Al, Au, Pd, Sb, Cr & Cu

Person-in-charge:

Mr. Yip P. S. - psanyip@hku.hk

Project/ Fund Source:

BRC(2020/21)/ UDF(2020/21), Nanofabrication Facilities

Kurt J. Lesker 150LE
Atomic Layer Deposition

Kurt J. Lesker ALD‑150LE is a versatile thin‑film deposition tool designed for research and development. Compact yet capable, it accommodates substrates up to 150 mm, offering reliable performance for laboratories exploring advanced coatings. Its accessible design makes it ideal for universities, startups, and innovators seeking precision materials engineering without the complexity of large‑scale systems.

Attachments / Specifications:

- Purely thermal configuration
- Substrate size: up to 6” (150 mm)
- Deposition Uniformity: Thermal HfO2 < 5Å
- Typical Processes: HfO2
- Deposition rate: 0.8 Å/cycle

Person-in-charge:

Mr. Yip P. S. - psanyip@hku.hk

Project/ Fund Source:

BRC(2020/21)/ UDF(2020/21), Nanofabrication Facilities