Oxford PlasmaPro 100 Cobra
Inductively Coupled Plasma Etching System

Oxford PlasmaPro 100 Cobra is a flexible inductively coupled plasma etching platform designed for advanced micro‑ and nanofabrication. Supporting wafers up to 200 mm, it delivers high etch rates, excellent uniformity, and low‑damage processing across diverse materials. Its versatility makes it ideal for research and industrial applications in semiconductors, optoelectronics, MEMS, and emerging device technologies

Attachments / Specifications:

- Gases available: Ar, CF4, C4F8, O2 & SF6

- RF Power source: 600 W(max) at 13.56 MHz

- Electrode coolant system: -30~80 °C

- Substrate size: 2~8 inch Si/glass substrate, small specimen

- Etch rate (uniformity within wafer: ± 5%): Silicon Dioxide: 250 Å/min, Silicon Nitride: 190 nm/min

Person-in-charge:

Mr. Yip P. S. - psanyip@hku.hk

Project/ Fund Source:

BRC(2020/21)/ UDF(2020/21), Nanofabrication Facilities

Elionix EIS-220P
Ion Beam Etching and Deposition system

Elionix EIS‑220P is an advanced ECR ion beam sputtering system designed for precision microfabrication. Equipped with dual ion guns, it enables seamless transitions between etching and deposition without breaking vacuum. Supporting reactive and inert gases, it offers flexible processing for diverse materials. Compact yet powerful, the EIS‑220P is ideal for research labs pursuing innovative thin‑film and nanostructure applications.

Attachments / Specifications:

- Gases available: Ar, CF4 & O2

- Power Source: 100 W / 2.45 GHz

- Sample substrate size: Maximum 4 inch, 3 mm thickness; small specimen

- Target size: Maximum 3 inch, 3 mm thickness

- Ion flow stability: ± 5% / 2h (1500 V, High acceleration electrode, Ar gas