The University of Hong KongThe University of Hong Kong
University Central Facilities
Interdisciplinary and Core Research Facilities

  1. Facilities
  2. Central Fabrication Laboratory (Bonding/ Packaging)

AML AWB04
Aligner Wafer Bonder

AML Aligner Wafer Bonder delivers high‑precision alignment and reliable wafer bonding for advanced semiconductor and MEMS applications. Designed for production and R&D environments, it combines accuracy, repeatability, and process flexibility to support anodic, fusion, and adhesive bonding with consistent, high‑yield performance.


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